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  Datasheet File OCR Text:
 TetraFET
D1014UK
METAL GATE RF SILICON FET
MECHANICAL DATA
C N (typ) B 3 D (2 pls)
2 1 A
F (2 pls) H J
GOLD METALLISED MULTI-PURPOSE SILICON DMOS RF FET 20W - 28V - 400MHz SINGLE ENDED
FEATURES
* SIMPLIFIED AMPLIFIER DESIGN
M
I
E
K
G
* SUITABLE FOR BROAD BAND APPLICATIONS * LOW Crss * USEFUL PO AT 1GHz
DP
PIN 1 PIN 3 SOURCE GATE PIN 2 DRAIN
DIM mm A 16.51 B 6.35 C 45 D 3.30 E 18.92 F 1.52 G 2.16 H 14.22 I 1.52 J 6.35 K 0.13 M 5.08 N 1.27 x 45
Tol. 0.25 0.13 5 0.13 0.08 0.13 0.13 0.08 0.13 0.13 0.03 0.51 0.13
Inches 0.650 0.250 45 0.130 0.745 0.060 0.085 0.560 0.060 0.250 0.005 0.200 0.050 x 45
Tol. 0.010 0.005 5 0.005 0.003 0.005 0.005 0.003 0.005 0.005 0.001 0.020 0.005
* LOW NOISE * HIGH GAIN - 13 dB MINIMUM
APPLICATIONS
* HF/VHF/UHF COMMUNICATIONS from 1 MHz to 400 MHz
ABSOLUTE MAXIMUM RATINGS (Tcase = 25C unless otherwise stated)
PD BVDSS BVGSS ID(sat) Tstg Tj Power Dissipation Drain - Source Breakdown Voltage Gate - Source Breakdown Voltage Drain Current Storage Temperature Maximum Operating Junction Temperature 87.5W 70V 20V 10A -65 to 150C 200C
Semelab plc.
Telephone +44(0)1455 556565. Fax +44(0)1455 552612. E-mail: sales@semelab.co.uk Website: http://www.semelab.co.uk
Prelim. 12/00
D1014UK
ELECTRICAL CHARACTERISTICS (Tcase = 25C unless otherwise stated) Parameter Test Conditions Min.
BVDSS IDSS IGSS gfs GPS Ciss Coss Crss Drain-Source Breakdown Voltage Zero Gate Voltage Drain Current Gate Leakage Current Forward Transconductance* Common Source Power Gain Drain Efficiency Input Capacitance Output Capacitance Reverse Transfer Capacitance VGS = 0 VDS = 28V VGS = 20V ID = 10mA VDS = 10V PO = 20W VDS = 28V f = 400MHz VDS = 0 VDS = 28V VDS = 28V VGS = -5V f = 1MHz VGS = 0 VGS = 0 f = 1MHz f = 1MHz IDQ = 0.2A ID = 100mA VGS = 0 VDS = 0 VDS = VGS ID = 1A 1 1.6 13 60 20:1 70
Typ.
Max. Unit
V 2 1 7 mA A V S dB % -- 120 50 5 pF pF pF
VGS(th) Gate Threshold Voltage*
VSWR Load Mismatch Tolerance
* Pulse Test:
Pulse Duration = 300 s , Duty Cycle 2%
HAZARDOUS MATERIAL WARNING
The ceramic portion of the device between leads and metal flange is beryllium oxide. Beryllium oxide dust is highly toxic and care must be taken during handling and mounting to avoid damage to this area. THESE DEVICES MUST NEVER BE THROWN AWAY WITH GENERAL INDUSTRIAL OR DOMESTIC WASTE.
THERMAL DATA
RTHj-case Thermal Resistance Junction - Case Max. 2.0C / W
Semelab plc.
Telephone +44(0)1455 556565. Fax +44(0)1455 552612. E-mail: sales@semelab.co.uk Website: http://www.semelab.co.uk
Prelim. 12/00


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